After discussing both leaded as well as SMT (surface-mount technology)
soldering, we come to the final installment of this series where we’ll cover
advanced SMT package soldering.
Ball grid arrays (BGAs) are a type of SMT package for integrated circuits
that attach to the board using a grid of solder balls on the underside of the
component. This allows for a large number of leads to make contact with a
very small area of a printed circuit board (PCB), even compared to the most
densely packed DIPs (dual in-line packages) and SOICs (small outline
integrated circuits). In the electronics industry where miniaturization is key,
this package style has proven easy to place
with manufacturing equipment and has also
been proven to be very robust in terms of
By Bob Wettermann and Nick Brucks Post comments on this article at www.servomagazine.com
Figure 1. The removed device.
62 SERVO 06.2015